8.9HFA Sn96.5Ag3.0Cu0.5, No Clean, Lead-Free, -325+500 (T3), 84%, Metals, Solder Paste 25 Gram Syringe Mfgr Part No: PASTEOT-801124 In Stock: 0 (Available To Order) Price: Request Quote
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8.9HFA Sn96.5Ag3.0Cu0.5, No Clean, Lead-Free, -325+500 (T3), 88.5%, Solder Paste 500 Gram Jar Mfgr Part No: PASTEOT-800714-500J In Stock: 0 (Available To Order) Price: Request Quote
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8.9HFA Sn96.5Ag3.0Cu0.5, No Clean, Lead-Free, -400+635 (T4), 88%, Solder Paste 500 Gram Jar (800693-500J) Mfgr Part No: PASTEOT-800693-500J In Stock: 0 (Available To Order) Price: Request Quote
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8.9HFA Sn96.5Ag3.0Cu0.5, No Clean, Lead-Free, -400+635 (T4), 88%, Solder Paste 600 Gram Cartridge (800693) Mfgr Part No: PASTEOT-800693-600C In Stock: 0 (Available To Order) Price: Request Quote
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8.9HFA Sn96.5Ag3.0Cu0.5, No Clean, Lead-Free, -400+635 (T4), 88.5%, Solder Paste 600 Gram Cartridge (800900) Mfgr Part No: PASTEOT-800900-600C In Stock: 0 (Available To Order) Price: Request Quote
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8.9HFA
Lead Free Solder Paste
Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
Features
Eliminates clogged apertures through advanced rheology
Excellent wetting
Halogen-free per EN14582 test method
Eliminates hot and cold slump
High oxidation resistance
Excellent soldering performance under high temperature and long reflow processes
