Selected Items (0)

Facebook Share Button Twitter Share Button

Search


Show results in new page:

Hours:
Mon - Thur
8am - 4:30pm ET 		kem-tron logo
Electronic Manufacturing Distribution Since 1989 		Holiday Closures:
Dec 25-26 and Jan 1

EM907
EM907 Sn96.5Ag3.0Cu0.5 88.5% T3 (-325+500) Lead Free No Clean Solder Paste 500 Gram Jar
Mfgr Part No: 70-0605-0810
In Stock: 0 (Available To Order)
Price: Request Quote
Add to order/quote

EM907 Sn96.5Ag3.0Cu0.5 88.5% T3 (-325+500) Lead Free No Clean Solder Paste 600 Gram Cartridge
Mfgr Part No: 70-0605-0811
In Stock: 0 (Available To Order)
Price: Request Quote
Add to order/quote

EM907 Sn96.5Ag3.0Cu0.5 88.5% T3 (-325+500) Lead Free No Clean Solder Paste 750 Gram ProFlow Cassette
Mfgr Part No: 70-0605-0819
In Stock: 0 (Available To Order)
Price: Request Quote
Add to order/quote

EM907



No Clean Paste

Kester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s). This solder paste also exceeds the reliability standards required by J-STD-004.