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TSF-6850



Tacky Soldering Flux

Kester TSF-6850 is a highly active, thixotropic water-soluble tacky soldering flux developed for use in thermally challenging lead-free soldering applications. The high activity of TSF-6850 improves wetting of lead-free alloys difficult to solder to substrate finishes including OSP-Cu, ENIG and Immersion finishes. TSF-6850 has successfully soldered interconnects having peak reflow temperatures exceeding 270.