WF-9955

No Clean Flux

Indium Corporation’s new WF-9955 soldering flux is an updated version of Indium’s best-selling WF-9942, designed to conform to the more rigorous standards of J-STD-004B Type ORL0. It has no intentionally added halogens, no rosin, and exhibits exceptional hole fill as well as pin-testing performance that can only be achieved with a rosin-free material. In addition to exhibiting excellent soldering performance on a wide range of board finishes and board types, WF-9955 also passes the updated and more rigorous reliability requirements of the J-STD-004B Surface Insulation Resistance (SIR) and Electromigration (ECM) tests.

• Halogen-free per J-STD-004B
• Light colored, low residue, and rosin-free flux and residue for enhanced pin-testing performance Rosin, modified rosins, and resins do contribute to enhanced heat stability for thick or difficult-to-solder boards and for the encapsulation of flux activators. However, the rosins and resins interfere with probe-testability.
• Tested compatibility with Hot Air Solder Leveled (HASL), Immersion Silver, Electroless Nickel Immersion Gold (ENIG) and Organically Solder Preserved (OSP) Copper surfaces.
• Tested for use with all common lead-free and tin-lead alloys, including: SAC305; SAC105; SAC0307; silver-free tin-copper plus additive alloys, such as Indium Corporation’s Sn995; 96.5Sn/3.5Ag; 63Sn/37Pb; 60Sn/40Pb; and many others.