Lead Free Solder Paste
Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.
- Eliminates clogged apertures through advanced rheology
- Excellent wetting
- Halogen-free per EN14582 test method
- Eliminates hot and cold slump
- High oxidation resistance
- Excellent soldering performance under high temperature and long reflow processes