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Electronic Manufacturing Distribution Since 1989

Mfgrs>Indium Corporation>8.9HFA
Products>Solder Paste/No Clean/Lead Free >8.9HFA
8.9HFA
8.9HFA Sn96.5Ag3.0Cu0.5, No Clean, Lead-Free, -400+635 (T4), 88%, Solder Paste 500 Gram Jar
Mfgr Part No: 800693-500G
In Stock: 13
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800693-500G



Lead Free Solder Paste

Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.

Features
  • Eliminates clogged apertures through advanced rheology
  • Excellent wetting
  • Halogen-free per EN14582 test method
  • Eliminates hot and cold slump
  • High oxidation resistance
  • Excellent soldering performance under high temperature and long reflow processes