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Electronic Manufacturing Distribution Since 1989

NXG1
NXG1 Sn96.5Ag3.0Cu0.5 88.5% T3 (-325+500) Lead Free No Clean Solder Paste 500 Gram Jar
Mfgr Part No: 70-3213-0810
In Stock: 0 (Available To Order)
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NXG1 Sn96.5Ag3.0Cu0.5 88.5% T3 (-325+500) Lead Free No Clean Solder Paste 600 Gram Cartridge
Mfgr Part No: 70-3213-0811
In Stock: 203
Price: Request Quote
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NXG1 Sn96.5Ag3.0Cu0.5 88.5% T3 (-325+500) Lead Free No Clean Solder Paste 750 Gram Proflow Cassette
Mfgr Part No: 70-3205-0819
In Stock: 30
Price: Request Quote
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NXG1



No Clean Lead Free Paste

Kester NXG1 is a lead-free, no-clean solder paste designed to be used in air and nitrogen atmospheres and handle the thermal requirements of lead-free alloys. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. NXG1 is capable of stencil printing downtimes up to 120 minutes with an effective first print down to 0.4mm (16 mil) pitch QFPs. NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux as per IPC ANSI/J-STD-004B is classified ROL1.