{"title":"Solder Paste","description":"\u003cp\u003eShop SMT solder paste for electronics assembly at KEM-TRON, including SAC305 lead-free and leaded formulations in no-clean, water-soluble, and rosin flux types from AIM, Kester, and Indium. \u003ca href=\"https:\/\/kem-tron.com\/pages\/solder-paste-guide-alloys-particle-sizes-flux-types-storage\" target=\"_blank\" rel=\"noopener noreferrer\"\u003eSolder paste selection guide →\u003c\/a\u003e\u003c\/p\u003e","products":[{"product_id":"em828-sn96-5ag3-0cu0-5-89-5-t3-325-500-lead-free-water-soluble-solder-paste-500-gram-cartridge","title":"Kester 70-0403-0823 EM828 Sn96.5Ag3.0Cu0.5 89.5% T3 (-325+500) Lead Free Water Soluble Solder Paste 500 Gram Cartridge","description":"\u003ch3\u003eKester 70-0403-0823 EM828 Sn96.5Ag3.0Cu0.5 89.5% T3 (-325+500) Lead Free Water Soluble Solder Paste 500 Gram Cartridge\u003c\/h3\u003e\n\u003cp\u003eKester EM828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959332864294,"sku":"70-0403-0823","price":161.55,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/em828-sn965ag30cu05-895-t3-325500-lead-free-water-soluble-solder-paste-500-gram-cartridge-5601789.jpg?v=1771545979"},{"product_id":"em828-sn96-5ag3-0cu0-5-89-5-t3-325-500-lead-free-water-soluble-solder-paste-500-gram-jar","title":"Kester 70-0403-0810 EM828 Sn96.5Ag3.0Cu0.5 89.5% T3 (-325+500) Lead Free Water Soluble Solder Paste 500 Gram Jar","description":"\u003ch3\u003eKester 70-0403-0810 EM828 Sn96.5Ag3.0Cu0.5 89.5% T3 (-325+500) Lead Free Water Soluble Solder Paste 500 Gram Jar\u003c\/h3\u003e\n\u003cp\u003eKester EM828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959332897062,"sku":"70-0403-0810","price":161.55,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/em828-sn965ag30cu05-895-t3-325500-lead-free-water-soluble-solder-paste-500-gram-jar-4963406.jpg?v=1771545979"},{"product_id":"em828-sn96-5ag3-0cu0-5-89-5-t4-400-500-lead-free-water-soluble-solder-paste-500-gram-jar","title":"Kester 70-0403-0910 EM828 Sn96.5Ag3.0Cu0.5 89.5% T4 (-400+500) Lead Free Water Soluble Solder Paste 500 Gram Jar","description":"\u003ch3\u003eKester 70-0403-0910 EM828 Sn96.5Ag3.0Cu0.5 89.5% T4 (-400+500) Lead Free Water Soluble Solder Paste 500 Gram Jar\u003c\/h3\u003e\n\u003cp\u003eKester EM828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959332929830,"sku":"70-0403-0910","price":175.2,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/em828-sn965ag30cu05-895-t4-400500-lead-free-water-soluble-solder-paste-500-gram-jar-2084691.jpg?v=1771545978"},{"product_id":"em828-sn96-5ag3-0cu0-5-89-5-t4-400-500-lead-free-water-soluble-solder-paste-500-gram-cartridge","title":"Kester 70-0403-0923 EM828 Sn96.5Ag3.0Cu0.5 89.5% T4 (-400+500) Lead Free Water Soluble Solder Paste 500 Gram Cartridge","description":"\u003ch3\u003eKester 70-0403-0923 EM828 Sn96.5Ag3.0Cu0.5 89.5% T4 (-400+500) Lead Free Water Soluble Solder Paste, 500 Gram Cartridge\u003c\/h3\u003e\n\u003cp\u003eKester EM828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959332962598,"sku":"70-0403-0923","price":175.2,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/em828-sn965ag30cu05-895-t4-400500-lead-free-water-soluble-solder-paste-500-gram-cartridge-4180005.jpg?v=1771545978"},{"product_id":"em907-sn96-5ag3-0cu0-5-88-5-t3-325-500-lead-free-no-clean-solder-paste-500-gram-jar","title":"Kester 70-0605-0810 EM907 Sn96.5Ag3.0Cu0.5 88.5% T3 (-325+500) Lead Free No Clean Solder Paste 500 Gram Jar","description":"\u003ch3\u003eKester 70-0605-0810 EM907 Sn96.5Ag3.0Cu0.5 88.5% T3 (-325+500) Lead Free No Clean Solder Paste 500 Gram Jar\u003c\/h3\u003e\n\u003cp\u003eKester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm\/16 mils) and is able to print at high speeds up to 6 in\/s (150 mm\/s). This solder paste also exceeds the reliability standards required by J-STD-004.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959332995366,"sku":"70-0605-0810","price":168.7,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/em907-sn965ag30cu05-885-t3-325500-lead-free-no-clean-solder-paste-500-gram-jar-1256921.jpg?v=1771545978"},{"product_id":"em907-sn96-5ag3-0cu0-5-88-5-t3-325-500-lead-free-no-clean-solder-paste-600-gram-cartridge","title":"Kester 70-0605-0811 EM907 Sn96.5Ag3.0Cu0.5 88.5% T3 (-325+500) Lead Free No Clean Solder Paste 600 Gram Cartridge","description":"\u003ch3\u003eKester 70-0605-0811 EM907 Sn96.5Ag3.0Cu0.5 88.5% T3 (-325+500) Lead Free No Clean Solder Paste 600 Gram Cartridge\u003c\/h3\u003e\n\u003cp\u003eKester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm\/16 mils) and is able to print at high speeds up to 6 in\/s (150 mm\/s). This solder paste also exceeds the reliability standards required by J-STD-004.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333028134,"sku":"70-0605-0811","price":202.45,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/em907-sn965ag30cu05-885-t3-325500-lead-free-no-clean-solder-paste-600-gram-cartridge-3844672.jpg?v=1771545978"},{"product_id":"em907-sn96-5ag3-0cu0-5-88-5-t3-325-500-lead-free-no-clean-solder-paste-750-gram-proflow-cassette","title":"Kester 70-0605-0819 EM907 Sn96.5Ag3.0Cu0.5 88.5% T3 (-325+500) Lead Free No Clean Solder Paste 750 Gram ProFlow Cassette","description":"\u003ch3\u003eKester 70-0605-0819 EM907 Sn96.5Ag3.0Cu0.5 88.5% T3 (-325+500) Lead Free No Clean Solder Paste 750 Gram ProFlow Cassette\u003c\/h3\u003e\n\u003cp\u003eKester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm\/16 mils) and is able to print at high speeds up to 6 in\/s (150 mm\/s). This solder paste also exceeds the reliability standards required by J-STD-004.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333060902,"sku":"70-0605-0819","price":292.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/em907-sn965ag30cu05-885-t3-325500-lead-free-no-clean-solder-paste-750-gram-proflow-cassette-7937189.png?v=1771464908"},{"product_id":"ep256-sn62pb36ag02-90-t3-325-500-no-clean-solder-paste-500-gram-jar","title":"Kester 70-0102-0310 EP256 Sn62Pb36Ag02 90% T3 (-325+500) No Clean Solder Paste 500 Gram Jar","description":"\u003ch3\u003eKester 70-0102-0310 EP256 Sn62Pb36Ag02 90% T3 (-325+500) No Clean Solder Paste 500 Gram Jar\u003c\/h3\u003e\n\u003cp\u003eEP256 is a no-clean, air or nitrogen reflowable solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333093670,"sku":"70-0102-0310","price":151.25,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/ep256-sn62pb36ag02-90-t3-325500-no-clean-solder-paste-500-gram-jar-4252423.jpg?v=1771545977"},{"product_id":"ep256-sn62pb36ag02-90-t3-325-500-no-clean-solder-paste-600-gram-cartridge","title":"Kester 70-0102-0311 EP256 Sn62Pb36Ag02 90% T3 (-325+500) No Clean Solder Paste 600 Gram Cartridge","description":"\u003ch3\u003eKester 70-0102-0311 EP256 Sn62Pb36Ag02 90% T3 (-325+500) No Clean Solder Paste 600 Gram Cartridge\u003c\/h3\u003e\n\u003cp\u003eEP256 is a no-clean, air or nitrogen reflowable solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333159206,"sku":"70-0102-0311","price":181.5,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/ep256-sn62pb36ag02-90-t3-325500-no-clean-solder-paste-600-gram-cartridge-1453434.jpg?v=1771545977"},{"product_id":"ep256-sn63pb37-90-t3-325-500-no-clean-solder-paste-500-gram-jar","title":"Kester 70-0102-0510 EP256 Sn63Pb37 90% T3 (-325+500) No Clean Solder Paste 500 Gram Jar","description":"\u003ch3\u003eKester 70-0102-0510 EP256 Sn63Pb37 90% T3 (-325+500) No Clean Solder Paste 500 Gram Jar\u003c\/h3\u003e\n\u003cp\u003eEP256 is a no-clean, air or nitrogen reflowable solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333224742,"sku":"70-0102-0510","price":87.9,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/ep256-sn63pb37-90-t3-325500-no-clean-solder-paste-500-gram-jar-9320200.jpg?v=1771545977"},{"product_id":"ep256-sn63pb37-90-t3-325-500-no-clean-solder-paste-600-gram-cartridge","title":"Kester 70-0102-0511 EP256 Sn63Pb37 90% T3 (-325+500) No Clean Solder Paste 600 Gram Cartridge","description":"\u003ch3\u003eKester 70-0102-0511 EP256 Sn63Pb37 90% T3 (-325+500) No Clean Solder Paste 600 Gram Cartridge\u003c\/h3\u003e\n\u003cp\u003eEP256 is a no-clean, air or nitrogen reflowable solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333257510,"sku":"70-0102-0511","price":105.5,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/ep256-sn63pb37-90-t3-325500-no-clean-solder-paste-600-gram-cartridge-8256072.jpg?v=1771545976"},{"product_id":"ep256-sn63pb37-90-t3-325-500-no-clean-solder-paste-750-gram-proflow-cassette","title":"Kester 70-0102-0519 EP256 Sn63Pb37 90% T3 (-325+500) No Clean Solder Paste 750 Gram ProFlow Cassette","description":"\u003ch3\u003eKester 70-0102-0519 EP256 Sn63Pb37 90% T3 (-325+500) No Clean Solder Paste 750 Gram ProFlow Cassette\u003c\/h3\u003e\n\u003cp\u003eEP256 is a no-clean, air or nitrogen reflowable solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333290278,"sku":"70-0102-0519","price":157.3,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/ep256-sn63pb37-90-t3-325500-no-clean-solder-paste-750-gram-proflow-cassette-6463554.png?v=1771464908"},{"product_id":"ep256-sn63pb37-90-t4-400-500-no-clean-solder-paste-1400-gram-cartridge","title":"Kester 70-0102-0618 EP256 Sn63PB37 90% T4 (-400+500) No Clean Solder Paste 1400 Gram Cartridge","description":"\u003ch3\u003eKester 70-0102-0618 EP256 Sn63PB37 90% T4 (-400+500) No Clean Solder Paste 1400 Gram Cartridge\u003c\/h3\u003e\n\u003cp\u003eEP256 is a no-clean, air or nitrogen reflowable solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333323046,"sku":"70-0102-0618","price":315.15,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/ep256-sn63pb37-90-t4-400500-no-clean-solder-paste-1400-gram-cartridge-8668641.png?v=1771464908"},{"product_id":"ep256-sn63pb37-90-t4-400-500-no-clean-solder-paste-500-gram-jar","title":"Kester 70-0102-0610 EP256 Sn63PB37 90% T4 (-400+500) No Clean Solder Paste 500 Gram Jar","description":"\u003ch3\u003eKester 70-0102-0610 EP256 Sn63PB37 90% T4 (-400+500) No Clean Solder Paste 500 Gram Jar\u003c\/h3\u003e\n\u003cp\u003eEP256 is a no-clean, air or nitrogen reflowable solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333388582,"sku":"70-0102-0610","price":102.2,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/ep256-sn63pb37-90-t4-400500-no-clean-solder-paste-500-gram-jar-6988954.jpg?v=1771545976"},{"product_id":"ep256-sn63pb37-90-t4-400-500-no-clean-solder-paste-600-gram-cartridge","title":"Kester 70-0102-0611 EP256 Sn63PB37 90% T4 (-400+500) No Clean Solder Paste 600 Gram Cartridge","description":"\u003ch3\u003eKester 70-0102-0611 EP256 Sn63PB37 90% T4 (-400+500) No Clean Solder Paste 600 Gram Cartridge\u003c\/h3\u003e\n\u003cp\u003eEP256 is a no-clean, air or nitrogen reflowable solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333421350,"sku":"70-0102-0611","price":115.65,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/ep256-sn63pb37-90-t4-400500-no-clean-solder-paste-600-gram-cartridge-6696050.jpg?v=1771545975"},{"product_id":"ep256ha-sn62pb36ag02-90-t3-325-500-no-clean-solder-paste-500-gram-jar","title":"Kester 70-0202-0310 EP256HA Sn62PB36Ag02 90% T3 (-325+500) No Clean Solder Paste 500 Gram Jar","description":"\u003ch3\u003eKester 70-0202-0310 EP256HA Sn62PB36Ag02 90% T3 (-325+500) No Clean Solder Paste 500 Gram Jar\u003c\/h3\u003e\n\u003cp\u003eEP256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metalizations. EP256HA is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333454118,"sku":"70-0202-0310","price":152.55,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/ep256ha-sn62pb36ag02-90-t3-325500-no-clean-solder-paste-500-gram-jar-3893134.jpg?v=1771545976"},{"product_id":"ep256ha-sn62pb36ag02-90-t3-325-500-no-clean-solder-paste-600-gram-cartridge","title":"Kester 70-0202-0311 EP256HA Sn62PB36Ag02 90% T3 (-325+500) No Clean Solder Paste 600 Gram Cartridge","description":"\u003ch3\u003eKester 70-0202-0311 EP256HA Sn62PB36Ag02 90% T3 (-325+500) No Clean Solder Paste 600 Gram Cartridge\u003c\/h3\u003e\n\u003cp\u003eEP256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metalizations. EP256HA is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333519654,"sku":"70-0202-0311","price":183.05,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/ep256ha-sn62pb36ag02-90-t3-325500-no-clean-solder-paste-600-gram-cartridge-6217257.jpg?v=1771545975"},{"product_id":"ep256ha-sn63pb37-90-t3-325-500-no-clean-solder-paste-500-gram-jar","title":"Kester 70-0202-0510 EP256HA Sn63Pb37 90% T3 (-325+500) No Clean Solder Paste 500 Gram Jar","description":"\u003ch3\u003eKester 70-0202-0510 EP256HA Sn63Pb37 90% T3 (-325+500) No Clean Solder Paste 500 Gram Jar\u003c\/h3\u003e\n\u003cp\u003eEP256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metalizations. EP256HA is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333585190,"sku":"70-0202-0510","price":87.15,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/ep256ha-sn63pb37-90-t3-325500-no-clean-solder-paste-500-gram-jar-7581420.jpg?v=1771545974"},{"product_id":"ep256ha-sn63pb37-90-t3-325-500-no-clean-solder-paste-600-gram-cartridge","title":"Kester 70-0202-0511 EP256HA Sn63Pb37 90% T3 (-325+500) No Clean Solder Paste 600 Gram Cartridge","description":"\u003ch3\u003eKester 70-0202-0511 EP256HA Sn63Pb37 90% T3 (-325+500) No Clean Solder Paste 600 Gram Cartridge\u003c\/h3\u003e\n\u003cp\u003eEP256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metalizations. EP256HA is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. 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EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metalizations. EP256HA is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. 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FL250D also has the capability of printing up to 200 mm\/sec (8in\/sec) with squeegees or within an enclosed head.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959333749030,"sku":"70-0902-0510","price":111.95,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/fl250d-sn63pb37-90-325500-no-clean-solder-paste-500-gram-jar-1891559.jpg?v=1771545972"},{"product_id":"fl250d-sn63pb37-90-325-500-no-clean-solder-paste-600-gram-cartridge","title":"Kester 70-0902-0511 FL250D Sn63Pb37 90% -325+500 No Clean Solder Paste 600 Gram Cartridge","description":"\u003ch3\u003eKester 70-0902-0511 FL250D Sn63Pb37 90% -325+500 No Clean Solder Paste 600 Gram Cartridge\u003c\/h3\u003e\n\u003cp\u003eKester FL250D is a no-clean, air or nitrogen reflowable solder paste specifically designed for automotive requirements. 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The outstanding batch consistency, anti-slump chemistry, consistent print volumes, solderability and cleanability make the HM531 an ideal water-soluble solder paste for any application.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959334043942,"sku":"70-1002-0510","price":86.95,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/hm-531-sn63pb37-90-t3-325500-water-soluble-solder-paste-500-gram-jar-2571225.jpg?v=1771545969"},{"product_id":"hm-531-sn63pb37-90-t3-325-500-water-soluble-solder-paste-600-gram-cartridge","title":"Kester 70-1002-0511 HM-531 Sn63Pb37 90% T3 (-325+500) Water Soluble Solder Paste 600 Gram Cartridge","description":"\u003ch3\u003eKester 70-1002-0511 HM-531 Sn63Pb37 90% T3 (-325+500) Water Soluble Solder Paste 600 Gram Cartridge\u003c\/h3\u003e\n\u003cp\u003eKester HM531 is a halide-free, organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. 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