{"product_id":"tsf-6516-no-clean-100g-jar","title":"Kester 302004 TSF-6516 No Clean 100g Jar","description":"\u003ch3\u003eKester 302004 TSF-6516 No Clean 100g Jar\u003c\/h3\u003e\n\u003cp\u003eKester TSF-6516 is a no-clan tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces.  The robust wetting action of TSF-6516 will allow OSP treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles.  Following reflow, TSF-6516 will leave aesthetically pleasing clear residues on the assembly.  TSF-6516 is designed for a wide range of temperature and humidity conditions.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959350526246,"sku":"302004","price":112.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/kester-302004-tsf-6516-no-clean-100g-jar-9535197.jpg?v=1772629214","url":"https:\/\/kem-tron.com\/products\/tsf-6516-no-clean-100g-jar","provider":"KEM-TRON INC.","version":"1.0","type":"link"}