{"product_id":"tsf-6592lv-no-clean-100g-jar","title":"Kester 300304 TSF-6592LV No Clean 100g Jar","description":"\u003ch3\u003eKester 300304 TSF-6592LV No Clean 100g Jar\u003c\/h3\u003e\n\u003cp\u003eKester TSF-6592LV is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework\/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.\u003c\/p\u003e","brand":"Kester","offers":[{"title":"Default Title","offer_id":51959351410982,"sku":"300304","price":112.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0994\/8761\/3222\/files\/kester-300304-tsf-6592lv-no-clean-100g-jar-7950054.jpg?v=1772628973","url":"https:\/\/kem-tron.com\/products\/tsf-6592lv-no-clean-100g-jar","provider":"KEM-TRON INC.","version":"1.0","type":"link"}