Selected Items (0)

Facebook Share Button Twitter Share Button

Search


Show results in new page:

Hours:
Mon - Thur
8am - 4:30pm ET
kem-tron logo
Electronic Manufacturing Distribution Since 1989
Holiday Closures:
Dec 25-26 and Jan 1


CW-807
Sn63Pb37 .032" CW807 1.8-2.5%, Halogen Free No Clean Wire 1lb Spool
Mfgr Part No: WIREFC-52905-0454
In Stock: 0 lb (Available To Order)
Price: Request Quote
Add to order/quote

Sn96.5Ag3.0Cu0.5 .020" CW807 1.8-2.5% Halogen Free No Clean Wire 1Lb Spool
Mfgr Part No: WIREFC-52915-0454
In Stock: 2 lb
Price: Request Quote
Add to order/quote

Sn96.5Ag3.0Cu0.5 .032" CW807 1.8-2.5% Halogen Free No Clean Wire 1Lb Spool
Mfgr Part No: 52890-0454
In Stock: 4 lbs
Price: Request Quote
Add to order/quote

CW-807



Halogen Free No Clean Wire

CW-807 is Indium Corporation’s best-selling flux-cored wire primarily because it is compatible with all Indium Corporation no-clean solder pastes, wave fluxes, and all common soft solder alloys. It also solders very well while still meeting the most recent requirements of J-STD-004B type ROL0. CW-807 contains less than 500 ppm total halogen, so it can be considered halogen-free by both J-STD-004B and JEITA ET-7304. CW-807 passes the more stringent Surface Insulation Resistance (SIR) and Electromigration (ECM) requirements of J-STD-004 revision B, therefore the no-clean residue will be electronically safe for virtually all applications. Also when properly configured,* cored wire with CW-807 yields superior results in automated soldering operations, including laser soldering.

Features
  • Halogen-free per J-STD-004B* To be halogen-free per J-STD-004B, the formula must contain less than 500ppm of any kind of halogen, ionic or nonionically bonded chlorine, bromine, or fluorine. This is new to J-STD-004B since fluxes that conform to the original J-STD-004 or J-STD-004A may still contain halogens that only disassociate at soldering temperatures, but leave a residue that contains ionic halogen.
  • Light-colored, low-smoking, rosin-containing fluxRosin, modified rosins, and resins contribute to enhanced heat stability and reliability. However, in some cases, rosins and resins may interfere with probe-testability.
  • Tested compatibility with Hot Air Solder Leveled (HASL), Immersion Silver, Electroless Nickel Immersion Gold (ENIG), and Organically Solder Preserved (OSP) Copper surfaces.
  • Tested for use with all common lead-free and tin-lead alloys, including:
    • SAC305
    • SAC105
    • SAC0307
    • SACm™
    • 96.5Sn/3.5Ag
    • 63Sn/37Pb
    • 60Sn/40Pb
    • 93.5Pb/5Sn/1.5Ag
    • Indalloy® 227
    • Indalloy® 254
    • silver-free tin-copper plus additive alloys, such as Indium Corporation’s Sn995
    • and many others.