Kester 70-0403-0910 EM828 Sn96.5Ag3.0Cu0.5 89.5% T4 (-400+500) Lead Free Water Soluble Solder Paste 500 Gram Jar
Kester EM828 is a lead-free, water-soluble solder paste formulated specifically to reduce voiding behavior that is common with lead-free solder paste products. EM828 represents a break-through in water-soluble solder paste technology with the combination of low voiding, excellent wetting behavior and ease of cleaning. Additionally, EM828 is extremely stable in the stencil printing process, regardless of print speed, idle time and throughput. EM828 provides tremendous wetting to a wide variety of board and component finishes in order to simplify your transition to lead-free processes.
