Kester 70-0202-0510 EP256HA Sn63Pb37 90% T3 (-325+500) No Clean Solder Paste 500 Gram Jar
EP256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metalizations. EP256HA is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256HA is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.
