Kester TSF-6502 is a no-clean tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces. The robust wetting action of TSF-6502 will allow OSP treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles. Following reflow, TSF-6502 will leave aesthetically pleasing clear residues on the assembly. TSF-6502 is designed for a wide range of temperature and humidity conditions.
