Kester TSF-6521C is a no-clean tacky soldering flux that exhibits a very high level of tack. TSF-6521C is designed for pick and place machines that are constantly moving the PCB at high speed doing component placement. The higher level of tack will help in limiting the amount of component displacement during component placement. TSF-6521C can be used in high speed dot dispensing for BGA/PGA sites or in a rework application for surface mount packages. TSF-6521C can also be printed utilizing standard stencil and printer parameters for use in PPT and Opti-pad processes. Kester maintains the highest standards by manufacturing TSF-6521C under a vacuum environment.
